From first schematic to validated hardware.

Power electronics design and simulation for engineers who need it to work the first time.

01

Power Architecture & Topology

Reference designs get you started, not to production. The right topology emerges from honest trade-off analysis — efficiency curves, control behavior across duty cycle extremes, and how GaN or SiC actually changes the equation for your application. We work through that analysis in simulation before a single component is ordered.

Topology Selection & Trade-off Analysis

  • Topology selection beyond the reference design: LLC, DAB, CLLC, SEPIC-Cuk combinations
  • Isolation trade-off analysis driven by safety requirements, cost, and noise
  • Control loop behavior at extreme duty cycles — where subharmonics hide
  • SPICE and behavioral simulation to validate before committing to a BOM

Wide Bandgap Converter Design

  • Honest GaN vs. SiC vs. silicon trade-off: speed, cost, and gate drive complexity
  • Commutation loop parasitic extraction and overshoot/ringing management
  • Dead-time optimization without shoot-through — validated in simulation
  • Soft-switching topology assessment: where the switching loss savings actually materialize

Motor Control & Drive Design

  • FOC vs. trapezoidal: real trade-off analysis for your torque and speed profile
  • High dV/dt mitigation to protect windings and reduce bearing current
  • Gate drive design for motor inverters: dead-time, shoot-through, and desaturation
  • Motor controller IC selection with derating and thermal margin verification
02

Design — Schematic, Layout & Magnetics

Most transformer and inductor problems are design problems, not winding problems — misunderstood leakage inductance, underestimated AC winding loss, or a turns ratio assumption that doesn't hold at load. On the PCB side, EMI failures and power integrity problems rarely surface in schematic review; they live in the layout. We address both before fabrication, not after a failed chamber visit.

Magnetics Design & Simulation

  • Transformer design with accurate leakage, turns ratio, and inductance factor modeling
  • AC winding loss analysis: proximity and skin effects at switching frequency harmonics
  • Planar and embedded PCB magnetics where discrete cores limit density
  • Thermal prediction coupled to FEA loss maps — before you wind a single turn

PCB Layout & Power Integrity

  • Power integrity analysis at the converter level — not just the system level
  • Current density mapping and IR drop: identify trace bottlenecks before fab
  • Stackup and via design for thermal performance and return current continuity
  • Component placement review to minimize switching loop area and coupling

EMI/EMC Pre-Compliance

  • CM and DM filter design based on identified emission sources, not guesswork
  • Log-scale noise floor analysis to locate dominant conducted emission contributors
  • Layout-level EMI mitigation: return paths, loop geometry, and ground stitching
  • 3D field simulation for noise coupling problems that layout rules alone can't resolve
03

Multiphysics Simulation

Circuit simulation won't tell you your transformer is going to thermally run away, or that your winding geometry is generating proximity losses that triple your copper loss at frequency. We run coupled EM, thermal, structural, and CFD analysis — because the failures that destroy hardware don't respect domain boundaries.

3D EM Field Analysis

  • Flux density and saturation mapping under DC bias and peak current
  • AC winding loss: proximity and skin effect losses quantified at operating frequency
  • Leakage inductance extraction — source of EMI, regulation error, and switching stress
  • Transient field simulation for inrush, saturation, and switching events

Thermal Runaway Prevention & Structural Analysis

  • FEM thermal simulation with EM loss maps as heat sources — not simplified power inputs
  • Hotspot prediction before prototype: junction temps, winding temps, core temps
  • Component derating and aging under sustained high temperature (>150°C operation)
  • Shock, vibration, and solder fatigue analysis for hi-rel and automotive applications

CFD & Thermal Management Design

  • Forced-air and natural convection CFD: flow paths, recirculation zones, dead spots
  • Liquid cooling design: cold plate geometry, flow rate, pressure drop, and ΔT budget
  • Fan selection with system impedance curve matching — not just datasheet airflow specs
  • Cooling design driven by EM loss maps, not assumed uniform power dissipation
04

Hardware Build, Test & Validation

The bench will find what simulation missed — but only if you know what to measure and how to measure it. Ripple probing has bandwidth limits. Switch-node waveforms mislead. Control-loop stability problems surface as EMI, jitter, and load-transient failures that look unrelated. We correlate simulation to hardware and use worst-case analysis to find failures that a single prototype won't expose.

Prototype Bring-Up & Root Cause Analysis

  • Power-on sequence planning and step-by-step bring-up to full operating point
  • Switch-node waveform analysis: interpreting ringing, overshoot, and duty-cycle anomalies
  • Input step-response testing to surface stability issues that Bode plots can miss
  • Root cause analysis: tracing system-level symptoms back to converter-level causes

Measurement-Accurate Verification & Worst-Case Analysis

  • Ripple and noise measurement: probe selection, bandwidth, and ground loop effects matter
  • Efficiency and loss breakdown correlated to FEM and circuit simulation predictions
  • Thermal camera vs. FEM: validating hotspot locations and temperatures, not just ballparks
  • Worst-case corner analysis — Monte Carlo and component tolerance sweeps beyond the prototype